Semiconductor device

ABSTRACT

A semiconductor device according to an embodiment comprises a semiconductor element, a first terminal, a plurality of second terminals, and an encloser. The semiconductor element is rectangular. The first terminal has an upper surface to which a back surface of the semiconductor element is bonded. The second terminals are arranged around the first terminal. The second terminals are arranged at four corners of the encloser to be exposed from the bottom surface, and sides of the semiconductor element are opposed to the first side, the second side, the third side, and the fourth side, respectively. The first terminal is apart from the first side surface and the third side surface, a lower surface of the first terminal is exposed from the bottom surface, and the first terminal is partly exposed from the second side surface and the fourth side surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/020,435, filed Sep. 14, 2020, which is based upon and claims thebenefit of priority from the prior Japanese Patent Application No.2020-049744, filed on Mar. 19, 2020 the entire contents of which areincorporated herein by reference.

FIELD

Embodiments of the present invention relate to a semiconductor device.

BACKGROUND

There is generally known a semiconductor device employing a so-called“non-leaded package” as a surface mount package, in which no leadextension from a resin package is provided and an electrode is exposedin a lower surface of the resin package. A semiconductor device adoptinga non-leaded package has a structure obtained by sealing a rectangularsemiconductor element together with a lead frame by a resin package.

The semiconductor device includes an island that is formed byappropriately cutting a metal lead frame patterned by etching or thelike and a plurality of leads that are arranged around the island.Further downscaling is demanded for such semiconductor devices.Therefore, the leads are arranged at four corners of the resin packageand the semiconductor element is generally arranged at an angle of 45degrees with respect to the resin package.

However, in order to arrange the semiconductor element at an angle of 45degrees with respect to the resin package, rotation or the like of thesemiconductor element is required, so that there is a risk that itsproduction efficiency is reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a bottom view of an explanatory diagram of a configuration ofa semiconductor device 1 according to an embodiment;

FIG. 1B is a top view of the semiconductor device according to theembodiment;

FIG. 1C is an A-A cross-sectional view of FIG. 1B;

FIG. 1D is a B-B cross-sectional view of FIG. 1B;

FIG. 2 is a diagram illustrating an arrangement example of a pluralityof semiconductor devices 1 in a resin sealing body;

FIG. 3A is a bottom view of an explanatory diagram of a configuration ofa semiconductor device 1 a;

FIG. 3B is a top view of the semiconductor device 1 a;

FIG. 3C is an A-A cross-sectional view of FIG. 3B;

FIG. 3D is a B-B cross-sectional view of FIG. 3B;

FIG. 4A is a bottom view of an explanatory diagram of a configuration ofa semiconductor device 1 b;

FIG. 4B is a top view of the semiconductor device 1 b;

FIG. 4C is an A-A cross-sectional view of FIG. 4B; and

FIG. 4D is a B-B cross-sectional view of FIG. 4B.

DETAILED DESCRIPTION

A semiconductor device according to an embodiment comprises asemiconductor element, a first terminal, a plurality of secondterminals, and an encloser. The semiconductor element is rectangular.The first terminal has an upper surface to which a back surface of thesemiconductor element is bonded. The second terminals are arrangedaround the first terminal. The encloser seals a conductive line providedbetween a front surface of the semiconductor element and an uppersurface of the second terminals, the semiconductor element, the firstterminal, and the second terminals, and has a bottom surface having arectangular shape including a first side, a second side, a third side,and a fourth side, a first side surface, a second side surface, a thirdside surface, and a fourth side surface that are respectively in contactwith the first side, the second side, the third side, and the fourthside, where the first side surface and the third side surface areopposed to each other, and the second side surface and the fourth sidesurface are opposed to each other. The second terminals are arranged atfour corners of the encloser to be exposed from the bottom surface, andsides of the semiconductor element are opposed to the first side, thesecond side, the third side, and the fourth side, respectively. Thefirst terminal is apart from the first side surface and the third sidesurface, a lower surface of the first terminal is exposed from thebottom surface, and the first terminal is partly exposed from the secondside surface and the fourth side surface.

A semiconductor device according to embodiments of the present inventionwill now be explained in detail with reference to the accompanyingdrawings. The embodiments described below are only examples of theembodiments of the present invention and it is not to be understood thatthe present invention is limited to these embodiments. In the drawingsreferred to in the embodiments, same parts or parts having identicalfunctions are denoted by like or similar reference characters and thereis a case where redundant explanations thereof are omitted. Further, forconvenience of explanation, there are cases where dimensional ratios ofthe parts in the drawings are different from those of actual productsand some part of configurations is omitted from the drawings.

First Embodiment

A configuration of a semiconductor device 1 according to an embodimentis described with reference to FIGS. 1A to 1D. FIGS. 1A to 1D areexplanatory diagrams of the configuration of the semiconductor device 1.FIG. 1A is a bottom view of the semiconductor device 1. FIG. 1B is a topview of the semiconductor device 1. FIG. 1C is an A-A cross-sectionalview of FIG. 1B. FIG. 1D is a B-B cross-sectional view of FIG. 1B. Inthe present embodiment, the direction from an upper surface to a lowersurface of the semiconductor device 1 is described as the Z-direction,and directions perpendicular to the Z-direction are described as theX-direction and the Y-direction.

As illustrated in FIGS. 1A to 1D, the semiconductor device 1 includesfour leads 2, an island 3, a semiconductor element 4, bonding wires 5,and a resin package 6. The semiconductor device 1 is a cuboid. The sizeof the semiconductor device 1 is not specifically limited to any size. Abroken line 50 in FIG. 1A illustrates leads 50 in a comparative exampledescribed later with reference to FIGS. 3A to 3D, and a broken line 60illustrates a formation example of an island 60 in the comparativeexample described later. FIG. 1B is a top view through the resin package6. Therefore, in practice, the upper surface of the semiconductor device1 is covered by the resin package 6. A broken line 200 in FIG. 1Billustrates the leads 2 in FIG. 1A, and a broken line 300 illustrates abottom-surface pattern of the island 3.

FIG. 2 is a diagram illustrating an arrangement example of a pluralityof semiconductor devices 1 in a resin sealing body 400.

As illustrated in FIG. 2, the semiconductor devices 1 are arranged inthe resin sealing body 400. Each of the semiconductor devices 1 isproduced by cutting a lead frame 500, together with resin, in the resinsealing body 400.

The material of leads 2 and that of the island 3 are not specificallylimited to any material and are Cu, for example. For example, the leads2 and the island 3 are formed by the same metal plate and are the sameas each other in the maximum thickness. The island 3 according to thepresent embodiment corresponds to a first terminal, the leads 2correspond to second terminals, the bonding wire 5 corresponds to aconductive line, and the resin package 6 corresponds to an encloser.

The four leads 2 are apart from the island 3 and a semiconductor element4. That is, in the present embodiment, the four leads 2 are arranged tobe apart from the island 3 and the semiconductor element 4 whileinterposing the island 3 and the semiconductor element 4 therebetween.The four leads 2 are arranged at four corners of the resin package 6 inthis manner. In this case, an edge portion in which the resin package 6covers the lead 2 may be provided on a side surface of the semiconductordevice 1, as indicated with an arrow W2 in FIG. 1B.

Each lead 2 includes a non-etched portion exposed from a bottom surfaceof the resin package 6 and a terminal half-etched portion 2 a that iscovered by the resin package 6 on a lower-surface side and has athickness smaller than that of the non-etched portion. The terminalhalf-etched portion 2 a extends from the non-etched portion towards theisland 3 and the adjacent lead 2 by a predetermined length (width). Theterminal half-etched portion 2 a can be formed by chemical etching orpressing, for example. The material of the resin package 6 covers theterminal half-etched portion 2 a to cover it.

In the present specification, the lower surface of the leads 2 and theisland 3 and the shape of the lower surface represent the non-etchedportion exposed from the bottom surface of the resin package 6 and theshape thereof. The shape of the leads 2 and the island 3 or the shape ofthe upper surface represents the shape of a portion including both thenon-etched portion and the half-etched portion in plan view. In the lead2 and the island 3, the non-etched portion and the half-etched portionsmoothly continue to each other in the upper surface. The upper surfaceof the leads 2 and the island 3 has a shape in which the lower surfaceof the leads 2 and the island 3 becomes larger by a width ofhalf-etching.

The lower surface of each lead 2 is exposed in the bottom surface of theresin package 6 except for the terminal half-etched portion 2 a, andserves as an external terminal that connects to a circuit board (notillustrated).

The lower surface of each lead 2 has a pentagonal shape, and has sides20 and 22 that are parallel to one pair of opposed sides of thesemiconductor element 4 and sides 21 and 23 that are parallel to theother pair of opposed sides of the semiconductor element 4. Each lead 2further has a side 24 that is not parallel to any side of thesemiconductor element 4 and is inclined at an angle of 45 degrees, forexample. The side 23 is shorter than the side 20.

The upper surface of each lead 2 has a pentagonal shape and has sides120 and 122 parallel to one pair of opposed sides of the semiconductorelement 4 and sides 121 and 123 parallel to the other pair of opposedsides of the semiconductor element 4. Each lead 2 further has a side 124that is not parallel to any side of the semiconductor element 4 and isinclined at an angle of 45 degrees, for example. The side 123 is shorterthan the side 120.

The lower surface of the island 3 has a substantially rhombic shape. Thelower surface of the island 3 according to the present embodiment has ashape obtained by rounding corners of a rhombus, for example,eliminating the corners. The island 3 is formed in such a manner thateach side of the rhombic shape of the lower surface of the island 3 isnot parallel to each side of the resin package 6. In other words, thelower surface of the island 3 has a shape having two pairs of sides, thesides of each pair being parallel to each other. The two pairs ofopposed sides of the island 3 are not parallel to any side of the resinpackage 6. Further, the length in the X-direction of the lower surfaceof the island 3 is longer than the length in the Y-direction. In theupper surface of the island 3, a portion except for portions 30 a and 30b is also substantially rhombic, and the same description as that of thelower surface of the island 3 can be also applied to the upper surface.

Further, the lower surface of the island 3 is exposed in the bottomsurface of the resin package 6. Furthermore, in the island 3, an islandhalf-etched portion 3 a is formed in a side surface opposed to the lead2. The material of the resin package 6 covers the island half-etchedportion 3 a. In other words, the island 3 includes a non-etched portionexposed from the bottom surface of the resin package 6 and the islandhalf-etched portion 3 a that is covered by the resin package 6 on alower-surface side and has a thickness smaller than that of thenon-etched portion. The island half-etched portion 3 a extends from thenon-etched portion on an XY-plane by a predetermined length (width).Accordingly, the strength of bonding between the island 3 and the resinpackage 6 can be increased. The island half-etched portion 3 a can beformed by chemical etching or pressing, for example.

The island half-etched portion 3 a of the island 3 includes thesuspension pin portions 30 a and 30 b that extend in the X-direction. Asillustrated in FIG. 2, because of the connection of the suspension pinportions 30 a and 30 b to the lead frame 500, it is possible to preventthe island 3 from falling out from the lead frame 500. In the presentembodiment, the regions 30 a and 30 b of the island 3 connected to thelead frame 500 adjacent thereto before cutting, as illustrated in FIG.2, are called suspension pin portions or suspension pins. In plan viewalong the Z-direction, the leads 2 are arranged at respective ends oftwo sides of the resin package 6 which extend in the X-direction. Twospaces A2 formed between ends adjacent to each other in the Y-directioninclude the suspension pin portions 30 a and 30 b.

Meanwhile, in plan view along the Z-direction, the island 3 is apartfrom the two sides of the resin package 6 which extend in theX-direction. In other words, the island 3 is apart from side surfaces ofthe resin package 6 which are parallel to the Z-direction and theX-direction. Therefore, in plan view along the Z-direction, it ispossible to provide a region B2 that is not in contact with the island 3nor the two sides of the resin package 6 which extend in theX-direction.

In FIG. 1B, that is, in plan view along the Z-direction, points at whichthe suspension pin portions 30 a and 30 b are in contact with twoopposed sides of the resin package 6 are at least two points that areapart from each other. As illustrated in FIG. 1A, a midpoint of theisland 3 is located between two points of the suspension pin portions 30a and 30 b in plan view.

The semiconductor element 4 (a semiconductor chip) is rectangular. Thesemiconductor element 4 is bonded on its back surface to the island 3with a bonding material interposed therebetween while a front surface (adevice-forming surface) on which functional elements are formed facesup. While the bonding material is a non-conductive bonding material, forexample, a conductive bonding material can be also used.

An angle formed between a side of the semiconductor element 4 and a sideof the resin package 6 is 20 degrees or less. More preferably, a side ofthe semiconductor element 4 and a side of the resin package 6 areparallel to each other. As illustrated in FIG. 1B, in plan view alongthe Z-direction, there is no corner of the semiconductor element 4located between the two leads 2 adjacent to each other in theX-direction. In plan view along the Z-direction, there is a corner ofthe semiconductor element 4 located between the two leads 2 adjacent toeach other in the Y-direction.

On the front surface of the semiconductor element 4, pads 4 acorresponding to the respective leads 2 are formed. One end of thebonding wire 5 is bonded to each pad 4 a. The other end of the bondingwire 5 is bonded to the upper surface of the corresponding lead 2.Accordingly, the semiconductor element 4 is electrically connected tothe lead 2 via the bonding wire 5.

A configuration of a semiconductor device 1 a according to a comparativeexample of the embodiment is described with reference to FIGS. 3A to 3D.FIGS. 3A to 3D are explanatory diagrams of the configuration of thesemiconductor device 1 a. FIG. 3A is a bottom view of the semiconductordevice 1 a. FIG. 3B is a top view of the semiconductor device 1 a. FIG.3C is a cross-sectional view taken along a line A-A in FIG. 3B. FIG. 3Dis a cross-sectional view taken along a line B-B in FIG. 3B.

As illustrated in FIGS. 3A to 3D, the semiconductor device 1 a includesthe four leads 50, the island 60, the semiconductor element 4, thebonding wires 5, and the resin package 6. The semiconductor device 1 ais a cuboid. The semiconductor device 1 and the semiconductor device 1 ainclude the semiconductor element 4 and the resin package 6. FIG. 3B isa top view through the resin package 6. Therefore, in practice, an uppersurface of the semiconductor device 1 a is covered by the resin package6. A broken line 200 a in FIG. 3B illustrates the lead 50 illustrated inFIG. 3A. The semiconductor element 4 has the same shape as alower-surface pattern of the island 60, for example, and is provideddirectly above the lower-surface pattern of the island 60.

As illustrated in FIG. 3A, in the lower surface, one side of each lead50 and four sides of the island 60 are arranged at a predeterminedangle, for example, an angle of 45 degrees with respect to sides of theresin package 6. That is, in the lower surface, one side of each lead 50is parallel to any side of the island 60 to be apart therefrom.

In the semiconductor device 1 a according to the comparative example, aside of the semiconductor element 4 is arranged at an angle of 45degrees with respect to a side of the resin package 6. Accordingly, thesemiconductor device 1 a is arranged in such a manner that the island 60and the lead 50 each have a large area and the upper surface of theleads 50 provided at four corners of the package 6 and the lower surfaceof the semiconductor element 4 are apart from each other.

The semiconductor device 1 a according to the comparative example ismanufactured, rotation is required which arranges a side of thesemiconductor element 4 at an angle of 45 degrees with respect to a sideof the resin package 6. Generally, the accuracy in alignment of thesemiconductor element 4 is reduced, in a case where the alignmentinvolves rotation. In the comparative example, one of corners of thesemiconductor element 4 is cut at an angle of 45 degrees and a sidegenerated by this cutting is aligned with the X-direction, therebyincreasing the accuracy of alignment in the rotation. Further, the areaof the island 60 is set to be large, thereby ensuring a large margin foralignment of the semiconductor element 4. Vertices of the semiconductorelement 4 that is rectangular are close to the sides of the resinpackage 6.

Further, the leads 50 are triangular. The lower surface of the island 60according to the present embodiment has a shape obtained by roundingcorners of a triangle, for example, eliminating the corners. Asuspension pin portion of the island 60 extends toward each side of theresin package 6. Because the island 60 and each lead 50 are close toeach other both in the X-direction and the Y-direction and also becausethe area of the island 60 is large, the possibility of short circuit isincreased.

The suspension pin portions of the comparative example extend in theX-direction and the Y-direction and prevent the island 60 from beingdisplaced or twisted while the island 60 is connected to a lead frame.

The semiconductor device 1 according to the embodiment does not includea suspension pin portion extending in the Y-direction and thus can makethe region B2 large. Accordingly, it is possible to ensure a wideclearance between the side 121 of the lead 2 and the island 3 in theX-direction. Therefore, even when further downscaling proceeds, it ispossible to prevent short circuit between the lead 2 and the island 3which may be caused by metal dragging or the like, when a lead frame iscut along a line extending in the X-direction.

The island 3 of the semiconductor device 1 has a substantially rhombicshape in which the length in the Y-direction is smaller than the lengthin the X-direction. Therefore, in the X-direction, a distance betweenthe island 3 and the side 24 of each lead 2 becomes larger from an endof a side surface of the resin package 6 toward a midpoint.

In the lead 2, the length in the Y-direction is shorter than the lengthin the X-direction. Therefore, also near the end in the X-direction ofthe side surface of the resin package 6, it is possible to ensure alarge distance between the island 3 and the side 24 of each lead 2.Further, it is possible to make a distance between the side 22 of eachlead 2 and the suspension pin portion 30 a or 30 b and a distancebetween the side 22 of each lead 2 and the back surface of thesemiconductor element 4 large.

Therefore, the possibility of short circuit between the lead 2 and theisland 3 or the like is further reduced. That is, a clearance is furtherincreased. Accordingly, it is possible to further downscale thesemiconductor device 1.

The suspension pin portions 30 a and 30 b are exposed from the resinpackage 6 at at least two points that are apart from each other in theY-direction, and are connected to a lead frame. Because a suspension pinportion branches into the suspension pin portions 30 a and 30 b, it ispossible to make a metal cut region in dicing smaller, relax theconcentration of stress, and improve the package quality as comparedwith a case where one thick suspension pin portion is provided. Further,in a case of using a dicing blade, clogging of the dicing blade can beprevented.

In the semiconductor device 1, a side of the semiconductor element 4 anda side of the resin package 6 form an angle of 20 degrees or lesstherebetween or are parallel to each other. Therefore, unlike thecomparative example, it is unnecessary to perform an operation ofarranging the semiconductor element 4 at an angle of 45 degrees withrespect to a side of the resin package 6, so that the productivity ofthe semiconductor device 1 is more improved. In other words, by settingthe side 23 of the lead 2 to be shorter, the semiconductor device 1 isformed to be arrangeable without arranging a side of the semiconductorelement 4 at an angle of 45 degrees with respect a side of the resinpackage 6.

Further, in the semiconductor device 1, it is possible to ensure a largedistance between the semiconductor element 4 and a side surface of theresin package 6. Therefore, stress applied to the semiconductor element4 when the resin package 6 is cut can be made small.

As described above, according to the present embodiment, the leads 2 arearranged at four corners of the resin package 6, and an angle formedbetween a side of the semiconductor element 4 and a side of the resinpackage 6 is set to 20 degrees or less. Accordingly, a distance betweena vertex of the semiconductor element 4 and a side of the resin package6 becomes longer, the possibility of short circuit between the island 3and each lead 2 is further reduced, and the semiconductor device 1 canbe further downscaled. In addition, it is unnecessary to perform anoperation of arranging the semiconductor element 4 at an angle of 45degrees with respect to a side of the resin package 6, so that theproductivity of the semiconductor device 1 is further improved.

Further, the island half-etched portion 3 a of the island 3 includes thesuspension pin portions 30 a and 30 b that extend in the X-direction andare exposed from a side surface of the resin package 6 in plan viewalong the Z-direction, and is formed to be apart from the side surfaceof the resin package 6 in the Y-direction. Accordingly, it is possibleto prevent the island 3 from falling out from a lead frame, and it isalso possible to provide the region B2 that is not in contact with theisland 3 nor the side surface of the resin package 6. In this manner,the semiconductor device 1 can be further downscaled, and theproductivity of the semiconductor device 1 is also further improved.

Modification of Embodiment

A semiconductor device 1 b according to a modification of the embodimentis different from the semiconductor device 1 according to the embodimentin that suspension pin portions 32 and 34 of the island 3 are arrangedto be offset from midpoints of sides of the resin package 6, which areopposed to the suspension pin portions 32 and 34, to left and right,that is, to opposite directions to each other.

FIGS. 4A to 4D are explanatory diagrams of a configuration of thesemiconductor device 1 b according to the modification of theembodiment. FIG. 4A is a bottom view of the semiconductor device 1 b.FIG. 4B is a top view of the semiconductor device 1 b. FIG. 4C is across-sectional view taken along a line A-A in FIG. 4B. FIG. 4D is across-sectional view taken along a line B-B in FIG. 4B. The suspensionpin portions 32 and 34 of the island 3 are arranged to be offset frommidpoints of sides of the resin package 6, which are opposed to thesuspension pin portions 32 and 34, to left and right, that is, toopposite directions to each other. Therefore, it is possible to reducetwisting with the suspension pin portions 32 and 34.

Although the semiconductor device 1 described in the presentspecification has been described as a semiconductor device including thesemiconductor element 4 mounted on a lead frame, the semiconductordevice 1 may be also a so-called “lead-frameless type” in which thesemiconductor element 4 is mounted on a substrate or the like.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel methods and systems describedherein may be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the methods andsystems described herein may be made without departing from the spiritof the inventions. The accompanying claims and their equivalents areintended to cover such forms or modifications as would fall within thescope and spirit of the inventions.

1. A semiconductor device comprising: a rectangular semiconductorelement; a first terminal having an upper surface to which a backsurface of the semiconductor element is bonded; a plurality of secondterminals arranged around the first terminal; and an encloser by which aconductive line provided between a front surface of the semiconductorelement and an upper surface of the second terminals, the semiconductorelement, the first terminal, and the second terminals are sealed,wherein the encloser has a bottom surface having a rectangular shapeincluding first, second, third, and fourth sides and first, second,third, and fourth side surfaces that are respectively in contact withthe first, second, third, and fourth sides, and the first and third sidesurfaces are opposed to each other, and the second and fourth sidesurfaces are opposed to each other, wherein the second terminals arearranged at four corners of the encloser to be exposed from the bottomsurface of the encloser, a lower surface of the first terminal isexposed from the bottom surface of the encloser, and the first terminalis partly exposed from the second and fourth side surfaces, and thelower surface of the first terminal has at least two pairs of opposedsides that are parallel to each other, none of the sides of the twopairs being parallel to any of the first, second, third, and fourthsides of the bottom surface of the encloser.
 2. The device of claim 1,wherein sides of the semiconductor element are parallel to the first,second, third, and fourth sides of the bottom surface of the encloser,respectively.
 3. The device of claim 1, wherein the first terminalincludes an island portion bonded to the semiconductor element and asuspension pin portion extending from the island portion and beingexposed from the second and fourth side surfaces.
 4. The device of claim3, wherein the suspension pin portion is exposed from the second andfourth side surfaces at points that are respectively apart from amidpoint of the second side and a midpoint of the fourth side inrespective directions in which the second and fourth sides extend. 5.The device of claim 1, wherein in plan view of the bottom surface, amidpoint of each side of the bottom surface is not included in anexposed portion of the first terminal exposed from the second and fourthside surfaces.
 6. The device of claim 1, wherein a length of the secondterminal in a direction parallel to the first side is longer than alength of the second terminal in a direction parallel to the secondside.
 7. The device of claim 1, wherein the first terminal includes afirst portion exposed from the bottom surface and a second portion thatis provided around the first portion, is covered by the encloser, and isthinner than the first portion.
 8. The device of claim 7, wherein thefirst terminal further includes a suspension pin portion extending fromthe second portion and being exposed from the second and fourth sidesurfaces.
 9. The device of claim 2, wherein the first terminal includesan island portion bonded to the semiconductor element and a suspensionpin portion that extends from the island portion and is exposed from thesecond and fourth side surfaces.
 10. The device of claim 1, wherein thesecond terminal includes a third portion exposed from the bottom surfaceand a fourth portion that is provided around the third portion, iscovered by the encloser, and is thinner than the third portion.
 11. Thedevice of claim 1, wherein the upper surface of the second terminal ispentagonal and has two sides parallel to one pair of opposed sides ofthe semiconductor element, two sides parallel to the other pair ofopposed sides of the semiconductor element, and a side parallel to oneside of the upper surface of the first terminal.
 12. The device of claim1, wherein the lower surface of the second terminal is pentagonal andhas two sides parallel to one pair of opposed sides of the semiconductorelement, two sides parallel to the other pair of opposed sides of thesemiconductor element, and a side being not parallel to one side of thelower surface of the first terminal, the one side of the lower surfaceof the first terminal opposed to the side.
 13. The device of claim 1,wherein the lower surface of the second terminal is pentagonal and hastwo sides parallel to one pair of opposed sides of the semiconductorelement, two sides parallel to the other pair of opposed sides of thesemiconductor element, and a side that is not parallel to any side ofthe semiconductor element and is inclined at an angle of 45 degrees withrespect to one side of the semiconductor element.
 14. The device ofclaim 1, wherein the encloser includes an edge portion in a sidesurface, the encloser covering the second terminal in the edge portion.15. The device of claim 1, wherein a surface of the second terminalexposed from the bottom surface is to be connected to a circuit board.16. The device of claim 1, wherein the first terminal and the secondterminal are formed of a same metal plate.
 17. The device of claim 1,wherein a material of the first terminal and that of the second terminalare copper.
 18. The device of claim 1, wherein a corner of therectangular semiconductor element protrudes from the upper surface ofthe first terminal in a direction parallel to the upper surface of thefirst terminal.